| N0. | project | technical indication |
| 1 | layer number | 2-12 layer (layers) |
| 2 | working board size (maximum) | 546mm*624mm |
| 3 | plate thickness | 0.2mm-3.5mm |
| 4 | Product board thickness tolerance | plate thickness 0.2mm-1.0mm + 0.1mm |
| plate thickness 1.01mm-1.6mm + 0.13mm | ||
| plate thickness 1.61mm-3.5mm + 0.15mm | ||
| 5 | plate curve (minimum) | = 0.7% |
| 6 | borehole aperture | 0.2mm-6.5mm |
| minimum drilling TM 0.2mm, finished product aperture 0.15mm | ||
| minimum length of long strip hole 0.6mm | ||
| long hole aperture tolerance NPTH + 0.05mm | ||
| long hole aperture tolerance PTH + 0.08mm | ||
| 7 | , the thickness of copper at the bottom of the outer layer is | 1/3oz-3oZ |
| 8 | sheet type | FR4, halogen free FR4, high TGFR4, Teflon, Rogers, CEM-3 |
| 9 | hole electroplating longitudinal and transverse ratio (maximum) | 8:1 |
| 10 | aperture tolerance | PTH + 0.075mm |
| NPTH + 0.05mm | ||
| 11 | hole wall copper thick | = 18um |
| 12 | inner line width / line distance (minimum) | H/H (0.075mm/0.075mm) 1/1 (0.1mm/0.1mm); 1/1; ";"; ";"; ";"; ";"; ";"; ";" 2/2 (0.15mm/0.15mm) and |
| 13 | outer line width / line distance (minimum) | T/T (0.075mm/0.075mm) . H/H (0.1mm/0.1mm) . 1/1 (0.127mm/0.127mm) . 2/2 (0.178mm/0.178mm) and |
| 14 | solder bridge width (minimum) | 0.08mm |
| 15 | external tolerance (minimum hole to edge) | + 0.1mm |
| 16 | thermal shock | 288 C 10 sec (3) |
| 17 | anti peeling strength | = 1.4N/mm |
| 18 | impedance control tolerance | + 10% |
| 19 | resistance welding layer strength | > 6H |
| 20 | surface treatment | OSP, gold, lead, tin, lead-free, tin, silver, tin, carbon, blue and |